Any Technology. Any Process.
Cadence APD+ leads the industry with the most comprehensive support for the latest packaging techologies. Design with confidence knowing APD has been proven on countless designs even at the most advanced nodes.
![](https://www.ema-eda.com/wp-content/uploads/2020/04/leadframe-intool-apd.png)
Lead Frame
Mechanical interfaces and advanced wirebonding
![](https://www.ema-eda.com/wp-content/uploads/2020/04/wirebond-in-apd.png)
Wirebond PBGA
2D & 3D DRC checking. All-angle/radial routing
![](https://www.ema-eda.com/wp-content/uploads/2020/04/flipchip-bga-inapd.png)
Flip Chip BGA
High capacity HDI structures & routing
![](https://www.ema-eda.com/wp-content/uploads/2020/04/chipscalepkg-inapd.png)
ChipScale Package (CSP)
Die stacking, HDI structures & routing
![](https://www.ema-eda.com/wp-content/uploads/2020/04/fan-in-wlcp-inapd.png)
Fan-in WLP (WLCSP)
Merged IC & package layout with GDSII output
![](https://www.ema-eda.com/wp-content/uploads/2020/04/fanout-wolwp-in-apd.png)
Fan-Out WLP (FOWLP)
Advanced outgassing with GDSII output
![](https://www.ema-eda.com/wp-content/uploads/2020/04/packageonpackage-inapd.png)
Package on Package (PoP)
3D visualization & DRC, Auto signal assignment
![](https://www.ema-eda.com/wp-content/uploads/2020/04/rf-module-inapd.png)
RF Module
Virtuoso integration, Parametrized structures
When You Need More Than Moore
The laws of physics are just one barrier straining the viability and effectiveness of Moores law. New system in package (SiP) technologies such as silicon interposers, 3D-IC, stacked die, etc are enabling companies to achieve the performance, cost, and schedule requirements they need without trying to re-write the physics textbook.
![](https://www.ema-eda.com/wp-content/uploads/2020/04/more-than-moore-image-1024x318.png)
What Our Customers & Partners Are Saying
![Suk Lee, TSMC senior director, Design Infrastructure Management Division](https://www.ema-eda.com/wp-content/uploads/2020/04/Tsmc.svg_.png)
![Dr. Wang-Jin Chen, senior technologist of Faraday](https://www.ema-eda.com/wp-content/uploads/2020/04/fartaday.png)
![Steven Lowder, Amkor's Vice President, Design Services](https://www.ema-eda.com/wp-content/uploads/2020/04/samsung_logo_678x452.png)
![Steven Lowder, Amkor's Vice President, Design Services](https://www.ema-eda.com/wp-content/uploads/2020/04/Amkor-logo-PMS293-transparent.jpg)