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Home > EMA Resources > Whitepaper > 2.5D Interposer Design Flow Using Dual-side Component Process in Cadence SiP Layout

Whitepaper

2.5D Interposer Design Flow Using Dual-side Component Process in Cadence SiP Layout

This application note uses an example to outline a recommended flow process for setting up 2.5D organic interposers in Cadence® SiP Layout that uses the new dual-side component support capabilities.
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