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Migrating from Altium to OrCAD X

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Migrating from Eagle to OrCAD X

Like many companies selecting OrCAD X, you have existing or legacy designs you need to convert or translate into OrCAD X. The good news is that OrCAD X is supplied with an integrated and proven Eagle design translator built in. This guide will walk you through the steps and process
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Rigid-Flex PCB Bending EM Analysis with Clarity

Learn how to perform Electromagnetic (EM) analysis when bending a rigid-flex design using Clarity 3D to ensure first-pass success.
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Overcoming Signal Integrity Challenges of 112G Connections

Learn how to handle signal integrity issues in 112G connections and ensure that data is transmitted successfully with minimal errors.
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RF to mmWave Design for Systems

With AWR Design Environment, address RF/ microwave design and integration through an Intelligent System Design™ strategy, which delivers computational software capabilities across all RF to mmWave Design for Systems design elements of electronic systems.
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Book Cover: Fundamentals of Component Data Management

Fundamentals of Component Data Management

If you are not exactly sure what Component Data Management (CDM) really is, or why it is important to you as an electrical engineer, you are reading the right article at the right time in your career.
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SE Connect BOM Risk Cheat Sheet

This cheat sheet is intended to provide defintions and additional explanation for categories within the SiliconExpert Connect BOM Risk App.
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SE Connect BOM Risk Sample Report

SE Connect BOM Risk App exports a PDF with supply chain details for your schematic design and components.
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Sunreef Yachts Case Study 2019

To satisfy a shift in customer preferences for highly customized luxury catamarans, Poland-based Sunreef Yachts needed to simulate and optimize their engineering processes to accelerate design and production of its boats.
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Wire Bond Profiles

Bond wires are 3D entities that connect a die pin to a package substrate finger or another die pin. This application note describes the process of defining Wire bond profiles and how they are applied to specific bond wires in the design.
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Whitepaper

System Electrothermal Transient Analysis of a High Current (40A) Synchronous Step Down Converter

In this paper, we detailed the system electrothermal transient co-design modeling and silicon validation effort that led to the industry’s first highly efficient, highest power density (40A) synchronous step-down converter.
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Sigrity X – Redefining Signal and Power Integrity

This white paper highlights the features in Cadence® Sigrity™ X signal and power integrity (SI/PI) solutions for system-level SI and PI analysis that enable designers to cut the number of design respins and meet short time-to-market windows with confidence.
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Whitepaper

Serial Link Engineering: A Novel Jitter/Noise Metric to Qualify Channel Components

This whitepaper will discuss a novel eye-area based normalized jitter and noise metric for serial link analysis.
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